Abstract:In this paper

a new kind of head structure and motion mechanism were developed by integrating synthetically a crank-rocker mechanism and a head face eccenter mechanism

that realize the operating functions of LED chip die bonders to drive chip of

such as picking up

carrying and bonding. Firstly

the working process and requirements of the head assembly were analyzed

the working theory of the head mecahniam was studied

the motion parameters of the crank-rocker mechanism were designed

a head face eccenter mechanism was developed

the motion time sequence of the excutive mechanisms was discussed. Secondly

the parts and assembly of the head structure and motion mechanism were designed by using pro/Engineer

the mechanim motion models and driving models were built

the motion simulation of the head mechanism was realized by using Mechanism/pro

the simulation results were analized

the head structure and mechanism parameters were optimized. Finally

the feasibility and rationality of the designed head mechanism and its simulation models were verified by testing the physical prototype

the developed head mechanism has been used in the whole equipment successfully

the performances of whole equipment have risen significantly.